Ansys 2024 R1

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Overview

Ansys 2024 R1 is the first major release of the year for the Ansys simulation software portfolio. It represents a significant step forward in Ansys’s strategy to make pervasive engineering simulation a reality. The release is characterized by three major themes:

1. Unprecedented Productivity: Drastically reducing simulation time and complexity through massive performance improvements, streamlined workflows, and enhanced automation.
2. Breakthrough Innovation: Introducing new technologies and physics to solve previously intractable problems, particularly in areas like AI, optics, and sustainability.
3. Expanded Accessibility: Making advanced simulation more accessible to non-experts through tighter integrations with CAD platforms, user-friendly interfaces, and cloud-enabled capabilities.

The release includes hundreds of updates across the entire portfolio. Below is a breakdown of the key enhancements in the major product categories.

Key Product Highlights in Ansys 2024 R1

1. Ansys Fluent (Computational Fluid Dynamics – CFD)

• Performance & Usability: Up to 3.8x faster solver speed for certain cases and a new, modern, streamlined user interface that simplifies the workflow from setup to results.
• GPU Solver Expansion: The popular GPU-accelerated solver now supports more physical models, including combustion (species transport) and noise (acoustics), making high-fidelity simulation on GPUs viable for a much wider range of problems.
• AI/ML Enhancements: A new Ansys AI+ offering includes a “Digital Twin Runtime” for creating real-time digital twins and reinforcement learning agents for optimizing control systems.
• Fluid-Structure Interaction (FSI): Tighter and more robust integration with Ansys Mechanical for simulating complex interactions between fluids and structures.

2. Ansys LS-DYNA (Explicit Dynamics)

• Smoothed Particle Galvanizing (SPG): A groundbreaking new method for simulating challenging manufacturing processes like riveting, crimping, and sheet metal joining with extreme deformation and material failure, which traditional methods struggle with.
• Electronics Drop Test Wizard: A new automated workflow specifically for simulating and improving the durability of consumer electronics (phones, laptops) during drop/impact events.
• Performance: Significant speed improvements for simulations involving composites and the discrete element method (DEM).

3. Ansys Mechanical (Finite Element Analysis – FEA)

• Faster Solvers: Up to 2x speedup in solving large, complex linear dynamics problems.
• Bolted Joint Analysis: A completely redesigned workflow that automates and simplifies the complex process of defining and analyzing bolted connections, saving immense amounts of time and reducing errors.
• Additive Manufacturing: Enhanced tools for simulating powder bed fusion processes, including new metrics for predicting defects and support structure generation.
• Seamless ECAD Integration: Directly import printed circuit board (PCB) designs and automatically generate high-fidelity models for structural, vibration, and thermal analysis.

4. Ansys Electronics Desktop (Electromagnetics – EMAG)

• Ansys Avalon: A new cloud-native EM solver for S-parameter extraction, built from the ground up to run on AWS, offering massive scalability for high-port-count designs.
• HFSS Mesh Fusion: Enhanced to include finite array domain decomposition, allowing engineers to solve enormous, full-system antenna-in-package and antenna-on-board problems that were previously impossible.
• Circuit and System Analysis: Major improvements in Ansys GRAPH for RF interference analysis and Ansys RaptorX for silicon-level signal integrity/power integrity.

5. Ansys Optics (Photonics & Optical Simulation)

• Ansys OptiSLang Integration: Optics now includes a license for Ansys optiSlang, bringing powerful design optimization and robustness analysis directly into the optical design workflow. This is a major step for designing optical systems for real-world, variable conditions.
• Enhanced Solvers: Performance improvements across Lumerical (FDTD, MODE, CHARGE) and Ansys Speos (for human vision and lighting simulation).

6. Ansys LS-DYNA (Explicit Dynamics)

• Smoothed Particle Galvanizing (SPG): A groundbreaking new method for simulating challenging manufacturing processes like riveting, crimping, and sheet metal joining with extreme deformation and material failure, which traditional methods struggle with.
• Electronics Drop Test Wizard: A new automated workflow specifically for simulating and improving the durability of consumer electronics (phones, laptops) during drop/impact events.
• Performance: Significant speed improvements for simulations involving composites and the discrete element method (DEM).

7. Platform & Ecosystem Enhancements

• Ansys Gateway on AWS: Simplifies access to cloud HPC resources, allowing users to launch pre-configured Ansys simulation environments in the cloud with just a few clicks.
• Ansys AI: Infused throughout the products, from smart meshing to result prediction and optimization, reducing the need for manual input and expert knowledge.
• CAD Integrations: Continued deep integration with PTC Creo, Siemens NX, and CATIA, allowing simulation to be performed directly within the native CAD interface.

Summary

Ansys 2024 R1 is not just an incremental update; it’s a transformative release focused on speed, scale, and accessibility. It empowers engineers to:

• Solve problems orders of magnitude faster than before.
• Tackle new classes of problems with innovative solvers like SPG in LS-DYNA.
• Perform high-fidelity simulation without being an expert thanks to automated workflows and AI-guided processes.
• Leverage the cloud for virtually unlimited computing power.

This release solidifies Ansys’s position as a leader in engineering simulation, pushing the boundaries of what is possible across all major physics domains.